Spin Single Wafer Cleaning Systems

Since the workpiece is immersed in the cleaning solution, the workpiece does not dry out before washing, preventing dirt from sticking and maintaining the cleanliness of the equipment.

Scrubbing the front and back surfaces of the workpiece with a PVA sponge effectively removes dirt adhering to the workpiece.

Depending on the dirt properties of the workpiece, you can choose a PVA sponge with or without warts.

By supplying the cleaning solution from the inside of the sponge, the accumulation of dirt on the sponge can be prevented.

Ideal for cleaning thin workpieces.

The end face of the workpiece is scrubbed with a PVA sponge supplied with a cleaning solution.

While applying ultrasonic vibrations to the cleaning solution, it’s sprayed in a shower shape for cleanig.

While mixing gaseous pure water, it’s sprayed onto the workpiece for cleaning.

Effective cleaning can be performed by reducing the amount of washing water used.